Notice

Electronic Design

As per your specifications

For your next electronic card design, be it simple or complex, trust UNGAVA. Our team has the experience and professionalism to deliver what you are looking for. We take pride in staying on budget and meeting deadlines established at the beginning of the project.

We strongly believe that clear specifications will assure the client a better price, deliverables as expected and faster time to production. That's why we help our client establish specifications through numerous communications during the project. That is the way we always work.

If, however, the client has commercial imperatives, we can react quickly since we are a medium-size company. Our engineer-designers directly operate the software: no need to involve "polygon-pushers". Initial specifications are established with the client and a first version (first functional prototype) can be quickly realized. Then, we improve the design with the client.
UNGAVA is comfortable with both methods. We have an impressive history of projects going directly into production, with few changes required.

In brief

	CLIENT SUPPORT • Product definition • Functional description • Part seeking and implantation (DFT, DFM) • Schema • Optimised Bill of Material (BOM) for production • Rapid prototyping • Debugging, test, and proof of performance • Production test beds • Modification Notice (ECO) • Documentation and production-phase details
	ANALOG CIRCUIT DESIGN We have experience with the following technologies: • Linear regulator power supply • AC supplies • High-voltage supplies (1200 Vpp) • Weak-signal boosting (microvolts) • Use of servo motor and stepper motor
	DIFITAL CIRCUIT DESIGN We have experience with the following technologies: • Use of servo motor and stepper motor • CPU: PowerPC, ARM, x86 • MPU: Atmel, Microchip, Freescale • DSP: TI, Freescale, DSP Slices (Xilinx) • RAM: DDR/DDR2/DDR3, NAND, NOR, ZBT • PCI: PCI, PCIe-1X/4X/8X • Serial: CAN, I2C, SPI, 1-Wire, Camera Link, custom, etc.
	PRINTED CIRCUITS DESIGN We design boards from 2 to 20 layers (and up to 64 layers on request). The placement of pieces is carefully studied to minimize noise, to facilitate heat dissipation and minimize assembly costs. Then, our routing is meticulously developed to assure performance and signal integrity. We have experience with the following technologies: • Chip casings: micro-BGA, TQFP, QFN, SOIC, etc. • RAM: DDR/DDR2/DDR3, QDR • Clocks: up to 2.5 GHz in serial link • Analog basis band: up to 50 MHz, 140 dB of dynamic • Vias: Burried, Blind, Epoxy-filled, Via-in-Via • Impedance and cross-talk control
	HUMAN-MACHINE INTERFACE DESIGN A good product allows the user to quickly and easily use all its functions . The secret is in the human-machine interface. We have experience with the following technologies: • Screens: TFT (CCFL and DEL), with character array • Pointers: touchpads, cutting wheel, encoders, resistive and capacitive tactile screens • Keyboards: domes on PCB, contacts on PCB, pushbutton, capacitive button
	CONNECTOR TECHNOLOGY USE AND DESIGN Each connector can be the weakest link of the circuit, that's why we carefully choose the right connector technology for the client application. We can also reduce a circuit's size by using certain micro-techniques: • Standard Flex • Custom Flex • High-density Connectors • Zero Insertion Force Connectors (ZIF) • Custom latch mechanic • Multi-Chip Module (MCM) • Die-on-Board (DOB) • Pinout conversion circuit
	CELERITY OF EXECUTION OYou will be impressed by our team’s efficiency and dynamism. Our motto: We’ll get it done and do it right!